AMTECH NC-559-ASM 100% Original Solder paste BGA PCB No-Clean 100g Solder paste Phone repair

Product Description

AMTECH NC-559-ASM 100% Original Solder paste BGA PCB No-Clean 100g Solder paste Phone repair

Description

AMTECH NC-559-ASM
Data type name

Main composition of flux

Rosin(CAS:65997-06-0),

Succinic acid(CAS::110-15-6),

Triethylene glycol monobutyl ether

(CAS:143-22-6),Antioxidant,Rust inhibitor.

Liveness Neutral

Viscosity 80 mPa.s

Colour Off-white translucent

Graininess 5-10μm

Poisonous Very low

PH value 8

Flash point 120℃

The main purpose

Chip, solder ball, tin-lead or tin-silver-copper alloy surface soldering aid and rework process

Remark

Very versatile halogen-free flux and has long been known.

AMTECH NC-559-ASM

NC-559-ASM solder paste has been used for many years and has been recognized by customers. Because of its superior welding performance, transparent residue, and low smoke, it is widely used in maintenance. NC-559-ASM solder paste has the following excellent points
1.Excellent capacity of solder-stickiness
2.Excellent Anti-wet Capacity
3.Widely used on BGA, PGA, CSP packages and Flip Chip Operation
4.Suitable for multiple PCB Reflow
5.No-clean and Lead free for Environmental protection

6. Applicable to value ball, generally used for North-South bridge, mobile phone chip, CPU Socket value ball.

7. For large-area hand-painted value balls (referring to chips), they need to be cleaned.
8. It is used for lattice value ball (such as CPU Socket on computer motherboard).
9. The residue after soldering is transparent, the solder ball is bright, and it does not contain halogen

(F / CL / Br / I) substances.

10. The paste has a moderate viscosity and a fine particle size, generally 2-5 μm. Suitable for hand brushes, Machine automatic printing and other processes.
11. It can be applied to both reflow soldering and manual value ball processes. Product main ingredients: imported rosin, active agent, organic solvent, thickener,

preservative, etc.Related information: MSDS data, SGS report.
12.Clear and very clean

Company Profile

Why Choose Us

Pros & Cons

Pros

No-clean formula eliminates the need for post-soldering cleaning
CE and RoHS certified for safe, environmentally friendly use
Fine 1-10μm particle size ensures precise, clean solder joints
Formulated with rust inhibitors and antioxidants to prevent flux residue corrosion

Cons

Requires a soldering iron or reflow station, not suitable for beginner hobbyists without prior experience
Flux residue may leave a faint sticky film on PCB surfaces even with the no-clean formula
Only available in a single 100g package size with no alternative quantity options

Common Questions

What material and composition is this solder paste made from?

This is a no-clean solder paste with a flux core containing rosin, succinic acid, triethylene glycol monobutyl ether, antioxidant, and rust inhibitor, with particle sizes between 1-10μm.

How much solder paste is included in each package?

Each package contains 100g of solder paste.

What electronic repair and assembly applications is this solder paste compatible with?

It is designed for BGA and PCB soldering, including phone repair and other small-scale electronic assembly tasks.

What is the primary usage of this solder paste?

It creates precise, clean solder joints for electronic repairs and PCB assembly, with a no-clean formula to skip post-soldering cleaning.

Where is this solder paste manufactured and shipped from?

This solder paste originates from Mainland China.