30pcs/lot AIN tablets Aluminum Nitride Ceramic sheet thermal insulation ceramic sheet TO-220/247/264/3P free shipping

Product Name: Aluminum Nitride Ceramic Sheet
Product material: AIN
Product color: white or dark gray
Thermal conductivity: 190-260w/m.k
Insulation performance: 15kv/mm
Scope of application: high-power equipment/ICMOS tube, IGBT chip thermal insulation/high-frequency power supply classmates/mechanical equipment, high current, high voltage, high temperature/insulation parts requiring heat conduction

AIN crystal uses 〔AIN4〕 tetrahedron as a structural unit covalently bonded compound, which has a wurtzite structure and belongs to the hexagonal crystal system. Chemical composition AI 65.81%, N 34.19%, specific gravity 3.261g/cm3, white or off-white, colorless and transparent single crystal, sublimation decomposition temperature under normal pressure is 2450℃. It is a high temperature and heat resistant material. Coefficient of thermal expansion (4.0-6.0) X10-6/℃. Polycrystalline AIN has a thermal conductivity of 260W/(m.k), which is 5-8 times higher than alumina, so it has good thermal shock resistance and can withstand extreme heat at 2200℃. In addition, aluminum nitride has the characteristics of not being corroded by molten aluminum, other molten metals and gallium arsenide, and especially has excellent corrosion resistance to molten aluminum.
Performance
(1) High thermal conductivity (about 320W/m·K), close to BeO and SiC, and more than 5 times that of Al2O3;
(2) The thermal expansion coefficient (4.5×10-6°C) matches with Si (3.5-4×10-6°C) and GaAs (6×10-6°C);
(3) Various electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength) are excellent;
(4) Good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, and can be sintered under normal pressure;
(5) Good optical transmission characteristics;
(6) Non-toxic.
Scope of application
1. Aluminum nitride powder has high purity, small particle size and high activity. It is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrate.
2. Aluminum nitride ceramic substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal large-scale integrated circuit heat dissipation substrate and packaging material.
3.Aluminum nitride has high hardness, which is higher than that of traditional alumina.It is a new type of wear-resistant ceramic material, but due to its high cost, it can only be used for severely worn parts.
4. Utilizing the heat resistance, melt erosion resistance and thermal shock resistance of AIN ceramics, GaAs crystal crucibles, Al evaporating dishes, magnetic fluid power generation devices, and high-temperature turbine corrosion-resistant parts can be made, and its optical properties can be used as infrared windows. Aluminum nitride film can be made into high-frequency piezoelectric components, ultra-large-scale integrated circuit substrates, etc.
5. Aluminum nitride is heat-resistant, resistant to corrosion by molten metal, stable to acid, but easily corroded in alkaline solution. The new surface of AIN will react when exposed to humid air to form a very thin oxide film. Using this feature, it can be used as a crucible and casting mold material for melting aluminum, copper, silver, lead and other metals. AIN ceramics have good metallization properties and can replace toxic beryllium oxide ceramics and are widely used in the electronics industry.