Amaoe BGA Reballing Stencil For DDR5/DDR6/BGA170/BGA180/DDR5X/BGA190 Video Memory Chip Graphics Tin Planting Solder Template
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Specifications
- Brand Name
- BestChip
- Model Number
- chip
- Origin
- Mainland China
- High-concerned chemical
- None
- Condition
- New
- Type
- Voltage Regulator
- Supply Voltage
- 3
- Dissipation Power
- 3
- Operating Temperature
- 3
- Application
- MOBILE PHONE
- Package
- SMD
Product Description
AMAOE BGA Reballing Stencil For DDR5/DDR6/BGA170/BGA180 DDR5X Video Memory Chip Graphics Tin Planting Steel Mesh IC Solder Template
6 In 1 Amaoe BGA Reballing Stencil Kit for DDR5X BGA190 Direct Heating Template with Fixture Rework Tools
Pros & Cons
Pros
- Compatible with a wide range of popular video memory and graphics IC chips including DDR5, DDR6, and BGA190
- Constructed from durable steel mesh for precise, long-lasting reballing projects
- Designed specifically for mobile phone hardware repairs, making it a targeted tool for smartphone techs
- Offers a high-quality, reliable reballing solution for compatible chip models
Cons
- Only works with the specific chip models listed, limiting its versatility for other BGA rework tasks
- Does not include a positioning fixture, which can make precise alignment during reballing more challenging for novice users
- No detailed usage instructions are included in the product listing, making it harder for new technicians to use effectively
- The product only includes the stencil template, with no additional solder paste or accessories required for full reballing projects
Common Questions
Which chips and components is this BGA reballing stencil compatible with?
This stencil kit is designed for use with DDR5, DDR6, DDR5X, BGA170, BGA180, and BGA190 video memory chips and graphics ICs.
What material is this reballing stencil constructed from?
It is made of high-quality steel mesh for precise, durable tin planting during BGA rework repairs.
What is the primary use of this Amaoe BGA reballing stencil?
It is used for solder tin planting on video memory chips and graphics ICs as part of mobile phone hardware rework and repair projects.
Is this product new, and what type of packaging does it include?
This is a brand-new, unused BGA reballing stencil kit, packaged in SMD-compliant packaging for secure transport and storage.
Where is this BGA reballing stencil produced and shipped from?
This product is manufactured in Mainland China, as noted in the official product specifications.
Product information last updated on November 19, 2025